Numerical Homogenization of Multi-Layered Corrugated Cardboard with Creasing or Perforation

The corrugated board packaging industry is increasingly using advanced numerical tools to design and estimate the load capacity of its products. This why analyses are becoming a common standard in this branch manufacturing. Such trends cause either use computational models that take into account full 3D geometry flat wavy layers board, or homogenization techniques simplify model. article presents theoretical considerations extend technique already presented our previous work. proposed here procedure also takes creasing and/or perforation (i.e., processes undoubtedly weaken stiffness strength locally). However, it not always easy how exactly these affect bending torsional stiffness. What known for sure degradation depends, among other things, on type cut, shape, depth as well their position direction relation corrugation direction. method can be successfully applied model smeared finite element define degraded interface stiffnesses crease line line.